The event brought together a host of PC manufacturing and infrastructure partners focused on delivering affordable, power efficient mini-notebooks to global markets
Some 500 VIA GMB Alliance partners attended the VIA GMB Tech Forum Spring, observing live demonstrations of the latest mini-notebook technologies, as well as presentations exploring business and technology trends in the market segment. Topics covered included new opportunities for memory module and SSD manufacturers, application utilization tips for embedded controller suppliers, and an overview of a wirelessly networked world and how we go about getting there.
A big announcement at the forum was the VIA Surfboard C855 Reference Design – an ultra-compact mainboard incorporating the VIA C7-M ULV processor, the brand new VIA VX855 unified IGP chipset, and advanced VIA multimedia and connectivity silicon.
The VIA Surfboard was specifically designed for easy integration into devices targeted at the rapidly growing mini-notebook market, and will not only reduce development time and costs for system manufacturers, but offers the latest advancements in ultra-mobile technology including smooth playback of high bit-rate 1080p HD video and outstanding 8-channel HD audio.
The future of mini-notebooks will combine the features of Computer, Communication and Consumer (3C) Electronics. By connecting the local supply chain and vendors, and by offering a detailed reference design, VIA aims to lower the technical barriers for partners who wish to enter the market. The VIA GMB Alliance combines top quality with the most trustworthy partner brands and distributors, to help customers to build unique and quality-assured devices.
This is only our first step, but the first of many!